PCB Design
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August 20, 2020
Exploring What’s New in CR-8000 2020
What drives the features that are added or updated in a new release? The majority of the changes or additions in any Zuken tool release are customer-driven. Our customers provide valuable insight into emerging technologies, process and methodology changes, and the direction in which their EDA needs are taking them. This post focuses on the high points of the CR-8000 2020 release.
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- Blog
Juni 30, 2020
CR-8000 2020 Supports Electronic Subsystem Design
CR-8000 2020 is Zuken’s flagship PCB design platform, and I’m pleased to share some of the most exciting details of the new product release with you. But before we get into the new product release discussion, you may be wondering why we call it a platform and not a tool. CR-8000 2020 has all the bells and whistles for electronic subsystem development.
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- Blog
Mai 21, 2020
Singing from the Same Page
In the race to industry 4.0 consistent data is vital for successful digitalization. One of the biggest threats are data silos. Data silos describe the storage of data that remains under the control of one department. Therefore it is typically isolated from the rest of the organization or lives on network folders that have no access control, read-and-write or version control.
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- Blog
April 21, 2020
Legacy Data Management and Migration with CR-8000
In today’s global value chains, data exchange and re-reuse are vital to support collaboration and productivity. But most data formats are proprietary. For any organization with an extensive database of ECAD data, the need for data migration will eventually arise.
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- Blog
März 26, 2020
Multi-Board-Design für Anwendungen mit unterschiedlichen Spannungen
Die Vorteile der Entwicklung aller Platinen eines Multi-Board Systems in einem durchgängigen System. Das so genannte Stacking von Platinen -das Stapeln von Leiterplatten als Alternative zur Verbindung über Kabeln - ist ein aktueller Trend, der die Herstellungskosten senken und die Zuverlässigkeit verbessern kann.
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- Blog
Oktober 17, 2019
Be First to Market with DDR5!
Double Data Rate 5 (DDR5) is the next-generation standard for random-access memory (RAM). The new specification promises to bring chips that have much higher performance than the existing DDR4 modules, as well as lower power consumption. Let us show you how you can be first to market with DDR5!
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- Blog
Juli 11, 2019
How to Calculate Trace Length from Time Delay Value for High-speed Signals
To keep a good high-speed signal quality from driver to receiver on a PCB is not an easy task for designers. One of the most challenging issues is managing the propagation delay and relative time delay mismatches. Let me take you through the process...
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- Blog
Juni 27, 2019
Who’s afraid of DDR4?
What IC designers do to help us route high-speed PCBs
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- Blog
Juni 13, 2019
Get to Know Your SPICEs
PCB designers typically have little or no experience with SPICE applications. No worries, follow along with me and get to know your SPICEs!
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- Blog
Mai 23, 2019
If you can’t scale the chip, you should scale something else
Do you know what a »Yogi-ism« is? Yogi-ism goes back to the name of the late Yogi Berra (1925 – 2015), an American professional baseball catcher, who was an 18-time All-Star and won 10 World Series championships – more than any other player in MLB history. After his career as a player, he turned to coaching, where he became famous for his “impromptu pithy comments, malapropisms, and seemingly unintentional witticisms, known as Yogi-isms”
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- Blog
Mai 02, 2019
Shorter Design Cycles with Better ECAD-MCAD Collaboration
Every day, more and more of our lives become connected with IoT technology. With billions of smart products already out there.
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- Blog
März 28, 2019
“You’re connected now caller” The risks of crosstalk.
Wussten Sie, dass der Ausdruck "Übersprechen" (engl. Crosstalk) aus der Zeit der Telefonzentralen stammt, in denen Mitarbeiter Anrufer miteinander verbunden haben, die manchmal ungewollt das Gespräch eines anderen hören konnten? Man sprach im wahrsten Sinne des Wortes über eine andere Leitung hinweg.
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- Blog
Februar 28, 2019
Inside Signal Integrity: Impedance Control - Part 2
In part 1 of this blog we took a back-to-basics approach and discussed line impedance and its effects in signal integrity. As every electrical conductor comprises capacitance, an inductance, and a frequency-dependent ohmic resistance, and with increasing frequencies, these electrical characteristics will influence and distort the signal.
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- Blog
Februar 21, 2019
Inside Signal Integrity: Impedance Control - Part 1
Impedance and impedance control belong to the oldest and most often discussed topics in PCB design. They are especially important with the high-speed design when related to signal integrity. In this, the first of a two-part blog, we’ll go back to the basics of impedance/impedance control and consider what influences line impedance. In part two, we’ll set about controlling it.
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- Blog
Februar 05, 2019
Making Movies with Customers: Why Renishaw choose Zuken, Plus Awesome Movie Bloopers
It’s not often you spend your work day laughing AND learning. But that’s how it went for Zuken Europe’s first foray into filming videos with our customers.
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- Blog
Dezember 31, 2018
Mitigating Board Complexity with System-level Engineering
Demand for faster data speeds is increasing. Boards are becoming more dense. Requirements call for the latest protocols and devices. Packaging constraints call for multi-board and flex-board systems. The surest sign of escalating board complexity lies in the fact that few are designed by a single engineer. Today, most require the coordination of many engineers instead. And overall, this trend shows no sign of abating. Board complexity looks like it will only get worse...
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There’s no doubt that board systems are getting more complex. System-level engineering can help mitigate those risks. One of the main advantages...