Chip Scale Integration

If you can’t scale the chip, you should scale something else

Menu

Do you know what a »Yogi-ism« is? Well, I didn’t, because I’m not an American, to begin with, and consequently I have no clue of baseball. But Wikipedia and a number of similar sites were quick to help: Yogi-ism goes back to the name of the late Yogi Berra (1925 – 2015), an American professional baseball catcher, who was an 18-time All-Star and won 10 World Series championships – more than any other player in MLB history. After his career as a player, he turned to coaching, where he became famous for his “impromptu pithy comments, malapropisms, and seemingly unintentional witticisms, known as Yogi-isms” (source: Wikipedia).

So, what does that mean? Well, he created a wealth of seemingly nonsensical phrases – which often had “an underlying and powerful message that offered not just humor, but wisdom”. Want an example? “Ninety percent of baseball is mental; the other half is physical”. Or about his favorite restaurant in St. Louis and why he no longer went there: “Nobody goes there anymore. It’s too crowded.” And finally: “It ain’t over, till it’s over.”

The future of Chip Scale Integration

How did I get to look up Yoga Berra and his Yogi-isms? Well, I came across it in a presentation on the future of computing and chip scaling, by Prof. Subramanian S. Iyer, Distinguished Professor at the UCLA Electrical and Computer Engineering, that my valued colleague, Humair Mandavia, from the Zuken Sozo Center in San Jose sent me with a request to write up a press release on Zuken’s support of the UCLA’s CHIPS program.

UCLA CHIPS consortium consists of industrial partners from material suppliers, equipment manufacturers, foundries to system integrators, and includes support from universities and government agencies and industrial consortia, working collaboratively to develop new packaging technologies and system architectures and develop the next generation workforce.

In this presentation, after reviewing the evolution of computing power and chip scaling, Prof. Iyer comes to the conclusion that the industry is facing a chasm between the soaring demand for computing power that, among others, calls for heterogeneous functional integration, and the slowing progress of chip-scale integration (“Moore’s law”) because of soaring cost and miniaturization challenges.

If you can’t scale the chip, you should scale something else

And here is where Yogi Berra comes into the story: After concluding that functional integration and chip-scaling are in a deadlock, Prof. Iyer comes up with a slide that asks the famous question: “What would Yogi say!” and he provides the answer: “So, if you can’t scale the chip, you should try to scale something else!”

What that “something else” is, and what Zuken contributes to it, can be read in Zuken’s latest press release »Zuken partners with UCLA Department of Engineering to develop cost-effective IC manufacturing methodologies for heterogeneous computing«.

Klaus Wiedemann
Klaus Wiedemann
Marketing Manager Europe
Klaus Wiedemann is responsible for Marketing Communications across Europe covering web content, public relations and marketing programs. He works with customers to highlight their success through case studies and presentations for Zuken Innovation World events. Klaus is an enthusiast for two-wheeled vehicles and owns several classic bikes he likes to maintain and repair.

Schreibe einen Kommentar

Deine E-Mail-Adresse wird nicht veröffentlicht. Erforderliche Felder sind mit * markiert

wp-header-1920x844-pcb-2025-2-510x310
  • Blog
Januar 31, 2025
Die wichtigsten PCB-Design-Trends für 2025

Die Leiterplattenindustrie entwickelt sich ständig weiter, da technologische Fortschritte und neue Marktanforderungen die Grenzen des Machbaren immer weiter verschieben. Bis 2025 werden mehrere wichtige Trends die Branche prägen. Mehr erfahren? Jetzt in unserem Blog nachlesen!

Read now
wp-header-1920x844-supply-chain-1-510x310
  • Blog
Januar 23, 2025
Supply Chain Risk Management in PCB Design with SiliconExpert and CR-8000 Integration

Supply chain risk management is critical for electronics design. By integrating SiliconExpert with CR-8000, engineers gain tools to streamline component selection, manage obsolescence, and ensure design continuity. This integration supports efficient workflows, reduces costs, and mitigates supply chain disruptions.

Read now
Industrial Automation: A focused engineer interacts with a futuristic holographic interface, showcasing the power of advanced technology in a modern industrial setting
  • Blog
Dezember 05, 2024
Die Zukunft gestalten: Herausforderungen und Innovationen im IoT der Industrie

Von der Automatisierung bis zur Echtzeitanalyse – das Industrial Internet of Things (IIoT) verändert die Industrie grundlegend. Doch hinter den Chancen lauern Herausforderungen: Können Sicherheit, Altgeräte und komplexe Systeme in Einklang gebracht werden? Erfahren Sie, wie intelligente Fabriken der Zukunft gestaltet werden und warum das IIoT der Schlüssel dazu ist.

Read now
wp-header-1920x844-pcb-510x310
  • Blog
November 28, 2024
Stack-Up Design und Impedanzkontrolle für High-Speed Leiterplatten

Der Layer-Stack-up und die präzise Berücksichtigung der Leitungsimpedanz sind entscheidend für robuste High-Speed-Designs. Erfahren Sie in unserem Blog, wie Sie Stack-ups optimal mit CR-8000 und Polar Speedstack™ gestalten können.

Read now