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Alle Beiträge in chronologischer Reihenfolge
- Blog
September 26, 2017
Improve Design Data Security Across Your Enterprise
This is one pretty scary world we live in. Every day there are stories about data breaches, network hacks and even possible spying by foreign software and hardware suppliers. Every individual has become hyper-aware of the security issues revolving around their personal data. A company’s need to protect its design IP is actually more critical than an individual’s need to protect their personal data.
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It is essential to insure that you are taking the necessary steps to maximize your product revenue while protecting your company’s intellectual ...
- Blog
September 19, 2017
25 Years of High Speed Design – Looking Back to the Future
It’s 25 years since the first FED Conference took place in Berlin back in 1993, as a gathering for the German-speaking electronic and PCB-related industry. This also happened to be the year we consider as the birth of high-speed design.
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It’s 25 years since the first FED Conference took place in Berlin back in 1993, as a gathering for the German-speaking electronic and PCB-relate...
- Blog
September 15, 2017
Does the Release Process to Manufacturing Keep You Up at Night?
Have you ever finished generating the manufacturing release package for the latest product design and then it occurred to you that something may be wrong? Imagine, it’s Thursday night and you just finished a nice dinner with the family. Your daughter’s soccer team won and the Broncos are playing the Chiefs tonight. It will be great to relax and enjoy the game.
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Have you ever finished generating the manufacturing release package for the latest product design and then it occurred to you that something may b...
- Blog
September 12, 2017
Things to Consider Before Investing in a New Electrical Engineering Tool
Feeling a bit dazed by the multitude of electrical applications available to you? With Zuken’s E3.series containing a host of products including E³.schematic, E³.fluid, E³.cable, E³.formboard, E³.panel, E³.RoutingBridge, E³.PLCBridge and E³.Wiring Diagram Generator, you may feel overwhelmed on your first approach.
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Feeling a bit dazed by the multitude of electrical applications available to you?
- Blog
August 29, 2017
A Few Thoughts on Avoiding DDR4 Layout Problems
DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins.
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This new approach makes it much easier to, for example, swap pins between banks, to achieve better length control.
- Blog
August 22, 2017
Translating New Product Requirements into Hardware Architecture
Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – including multiple design tools – circuit design, PCB layout, mechanical design, spreadsheets, etc. that are used to track different elements of the design.
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Defining initial hardware architecture requires many decisions, most of which impact a variety of different stakeholders and requirements – incl...
- Blog
August 02, 2017
Hardware Architecture Design Becomes the Next Competitive Requirement
After a lengthy quiet period, the hardware design process is suddenly experiencing numerous changes in the form of design discipline convergence and process extension. The widely used 2D single board PCB detailed design process is being replaced by a 3D multi-board and multi-discipline one.
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Hardware architecture design is becoming a competitive requirement as product complexity is on the rise and the room for error is shrinking.
- Blog
Juli 14, 2017
Renishaw Designs Flex PCBs in True 3D with MCAD Integration using Zuken's CR-8000
The PCB design team at Renishaw work with flex PCBs and flexi-rigid boards that require detailed signal integrity analysis. To achieve the most accurate results they are working with Zuken’s electronic PCB design software to visualize boards in 3D using imported MCAD data. This also ensures that sure high-speed digital signals can be transmitted with minimal distortion.
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When Renishaw decided to migrate to Zuken’s latest PCB design suite in 2016, a main driver was the suite’s capabilities for designing and anal...
- Blog
Juni 21, 2017
Predictive Failure Analysis Can Improve Product Quality: The Reality - Part 2 of 2
I recently talked on predictive failure analysis at the PTC LiveWorx 2017 conference. There was a lot of audience interest, so I thought I’d share some of the things I discussed. This is the second of two posts on this subject.
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We all know that manufacturing yields and costs are the driving force behind product development, rather than product quality.
- Blog
Juni 15, 2017
Predictive Failure Analysis Can Improve Product Quality - Part 1 of 2
I recently talked on predictive failure analysis at the PTC LiveWorx 2017 conference. There was a lot of audience interest, so I thought I’d share some of the things I discussed.
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The good news is that more and more devices are becoming part of the Internet of Things (IoT), which extends the design team’s visibility beyond...
- Blog
Juni 06, 2017
Design Time vs. Admin Overheads: How to Win the Battle by Closing the Gaps
No more distractions, please! 45% of our time is already spent on admin. If you’re the average engineer, that is.
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Techconsult, a German-based analyst firm has just found that almost half of the engineering time of any manufacturing company is spent feeding sys...
- Blog
März 16, 2017
E3.series Integration with Creo, CATIA and NX for Wire Lengths and Harness Structures
Today I’m going to take a look at the functionality within E3.series that allows you to integrate with MCAD systems including Creo, CATIA and NX, to define cable lengths and harness structures. You can also watch a movie that shows how this is done in real life – transferring data back and forth from E3.schematic to Creo Parametric (aka ProE).
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Electrical and MCAD integration, if you’re not already doing it, has the potential to save you a good deal in the electrical product development...
- Blog
März 10, 2017
E3.series Offers French Motorsport Company Liberation from Design Admin and Increased Turnaround
Zuken welcomes another automotive and motorsport company to the growing club of E3.series users within this exciting sector. French company Techno MAP joins recent members M-Sport, HCI Systems, Teepee Electrical and others who have adopted E3.series based on peer recommendations about the tool’s flexibility, ease of adoption and increased productivity.
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French company Techno MAP joins recent members M-Sport, HCI Systems, Teepee Electrical and others who have adopted E3.series based on peer recomme...
- Blog
März 03, 2017
Growing Pains in the Wearables Market
With key functionality in many cases commoditized, the success or failure of wearables is increasingly determined in the early stages of the PCB and mechanical integration process where requirements are translated into practical design decisions such as how functions are mapped to PCBs and PCBs are integrated into the enclosure.
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With key functionality in many cases commoditized, the success or failure of wearables is increasingly determined in the early stages of the PCB a...
- Blog
Januar 27, 2017
Return Vias, Build-Up Layers and the Latest FPGAs to Battle Latest Signal Integrity Challenges
In the final installment of this blog series, you can learn how to use build-up layers and premium FPGAs to deal with the signal integrity challenges arising from high-speed signals in a 3D design capture world.
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Luckily, where signals need return vias, component vendors often do most of the work for you. Let’s look at a PCI Express differential pair. Fi...
- Blog
Januar 19, 2017
Using Vias to Maintain PCB Signal Integrity Featuring High-Speeds in a 3D Environment
This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and growing adoption of PCB design environments to design in true 3-D. Today I focus on vias and the use of return vias to overcome the issues highlighted in Part 1.
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This is the second in my series of blog posts looking at the challenge of maintaining PCB signal integrity with now-common ultra-high speeds and g...