CR-8000 Design Force
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January 30, 2018
Tech Tip: Mirroring Routed Double-sided Components in CR-8000 Design Force
A common task that is often dreaded among PCB designers is having to relocate a large point-count BGA that’s fanned out, and even partially escaped routed, to the opposite side of a PCB.
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A common task that is often dreaded among PCB designers is having to relocate a large point-count BGA that's fanned out, and even partially escape...
- Blog
January 25, 2018
Advanced Packaging with Zuken’s CR-8000 Design Force
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs.
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Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for ove...
- Blog
December 07, 2017
How Virtual Prototyping Tools Can Help Decide if Fan-out Wafer-level Packaging is Right For Your Product
Since it contributed to making the iPhone 7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the collective consciousness. By adopting FO-WLP on this scale, Apple sent out a signal that though highly novel, the technology had matured.
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Since it contributed to making the iPhone7 even thinner than its predecessors, fan-out wafer-level packaging (FO-WLP) technology has risen in the ...
- Blog
November 13, 2017
Toshiba – RF Module Shrink (TransferJet™)
Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm...
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Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phon...
- Blog
October 11, 2017
The Challenges of 3D PCB Designing (PCB West Interview)
During PCB West Exhibition Day, Sierra Circuits met Humair Mandavia, Chief Strategy Officer at Zuken. After his joint interview with Simon Fried, CBO of Nano Dimension, we discussed 3D PCB designing, and Zuken’s product, CR-8000 with him.
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During PCB West Exhibition Day, Sierra met Humair Mandavia, Chief Strategy Officer at Zuken. After his joint interview with Simon Fried, CBO of Na...
- Blog
October 09, 2017
How to Improve Flexible Printed Circuit Manufacturing (PCB West Interview)
Sierra met Steve Watt, Manager of PCB Engineering at Zuken, during PCB West 2017 at the Santa Clara Convention Center. After his presentation on how to improve flexible printed circuit manufacturing, he shared a few tips in front of our camera. Listen to him discuss CR-8000, DfM checks, and flexible PCB designing.
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Sierra Circuits met Steve Watt, Manager of PCB Engineering at Zuken, during PCB West 2017 at the Santa Clara Convention Center. After his presenta...
- Blog
September 19, 2017
25 Years of High Speed Design – Looking Back to the Future
It’s 25 years since the first FED Conference took place in Berlin back in 1993, as a gathering for the German-speaking electronic and PCB-related industry. This also happened to be the year we consider as the birth of high-speed design.
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It’s 25 years since the first FED Conference took place in Berlin back in 1993, as a gathering for the German-speaking electronic and PCB-relate...
- Blog
August 29, 2017
A Few Thoughts on Avoiding DDR4 Layout Problems
DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins.
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- Blog
July 14, 2017
Renishaw Designs Flex PCBs in True 3D with MCAD Integration using Zuken's CR-8000
The PCB design team at Renishaw work with flex PCBs and flexi-rigid boards that require detailed signal integrity analysis. To achieve the most accurate results they are working with Zuken’s electronic PCB design software to visualize boards in 3D using imported MCAD data. This also ensures that sure high-speed digital signals can be transmitted with minimal distortion.
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When Renishaw decided to migrate to Zuken’s latest PCB design suite in 2016, a main driver was the suite’s capabilities for designing and anal...
- Blog
March 11, 2016
Are you Making the Most of Modular Design With Design Reuse? Part 1
In this two part series of blog posts, I’m going to be looking at reuse with modular design in PCB development, and how you can streamline your methodology to reduce design time, reduce design errors and increase product quality.
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Although we’ve been talking about it for years, in PCB design it has yet to catch on in quite the same way despite there being a host of benefit...