IC Packaging Design

electronic subsystem design
  • Blog
June 30, 2020
CR-8000 2020 Supports Electronic Subsystem Design

CR-8000 2020 is Zuken’s flagship PCB design platform, and I’m pleased to share some of the most exciting details of the new product release with you. But before we get into the new product release discussion, you may be wondering why we call it a platform and not a tool. CR-8000 2020 has all the bells and whistles for electronic subsystem development.

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Advanced Packaging with Zuken’s CR-8000 Design Force
  • Blog
January 25, 2018
Advanced Packaging with Zuken’s CR-8000 Design Force

Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs.

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Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for ove...
cadstar pcb layout
  • Blog
August 29, 2017
A Few Thoughts on Avoiding DDR4 Layout Problems

DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins.

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