Thermal Analysis

a PCB design layout with various parameters and settings on the right-hand side, illustrating the process of preparing the design data for export and subsequent simulation. integration capabilities between ECAD and MCAD tools for advanced engineering simulations.
  • Blog
November 19, 2019
Tech Tip: How to export MCAD data from CR-8000 Design Force to enable faster thermal simulation in ANSYS Icepak

This video demonstrates how you can export a STEP file from CR-8000 Design Force including automatically editing your package shape and deformation spec to reduce heat transfer and fluid flow simulation time in ANSYS Icepak.

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Toshiba – RF Module Shrink (TransferJet™)
  • Blog
November 13, 2017
Toshiba – RF Module Shrink (TransferJet™)

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm...

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Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phon...