Multi-board constraint browser to view and analyze system level interconnects.
Chip-Package-Board Co-Design
Comprehensive Design Integration for Complex IC Package Design
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CR-8000 Design Force Advanced Packaging
In addition to advanced PCB layout capabilities, Design Force provides chip, package, and board co-design capabilities to enable real-time 3D hierarchical design. The chip design software allows design teams to concurrently create any combination of advanced die stacks, packages, and PCBs.
Automatic ball assignment with the ability to optimize complex routing solutions
Single environment for high-speed design with constraint management and SI and PI analysis
Powerful routing engines for rapid feasibility studies or detailed RDL and bump escape routing of signals and power and ground nets
Chip-Package-Board Co-Design
Comprehensive system co-design recognizes the interaction between chip, package, and board data to reduce complexity, size and cost of the overall system.
Take a look at CR-8000 Design Force Co-Design
CR-8000 Design Force Features
Design Force chip, package and board co-design provides a technology-rich and device-rich design environment for implementing traditional and advanced node design structures like die + package + PCB, SiP, PiP, and interposer + TSV.
Design Force Chip-Package-Board Co-Design provides a single environment solution for maximum system optimization.
Design Force supports integrations to best-in-class tools from partners such as ANSYS, AWR, Agilent and Synopsys for RF, Full Wave FD/TD, power integrity, and thermal extraction and analysis. This allows designers to address key issues early in the design process.
Optional Additions
The following can be added to extend the functionality of Design Force
Post layout extraction of single and coupled (crosstalk) routed traces; What-if analysis; Cross-section view for traces.
A simulation environment for post layout signal integrity simulation.
A powerful PCB-FPGA co-design environment that enables exchange of I/O and constraint information between PCB designs and FPGA designs.
A simulation environment for Power Integrity (AC impedance and de-coupling impact, DC voltage drop, current analysis) and electro-magnetic interference (EMI full board screening, differential mode, common mode, power bus noise).
Fast and easy check of the current density of a layout structure towards a given maximum.
Related Resources
Find out more via our webinars, blogs, press releases and more...
- Press Release
December 06, 2022
Zuken Supports Next-Generation 3D LSI-Semiconductor Mounting Design Technology
Zuken helps to overcome design challenges associated with 3D integration in the pursuit of next-generation semiconductor technologies.
Read now
- Press Release
December 05, 2022
Zuken and CSA Catapult Present Results of an R&D Collaboration for the Optimization of Tools for the Design of Power Modules
Zuken, a global leader in the area of software and solutions for electronic and electrical engineering, and Compound Semiconductor Applications (CSA) Catapult are announcing an important milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products.
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CR-8000 Design Force is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.
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3D Multi-board PCB Design