Resources by GENESYS: Model-based Systems Engineering (MBSE)

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 White Paper
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Case Study Examples of successful deployments of Zuken technology in customer specific process landscapes Datasheet Detailed descriptions of Zuken software products Press Release Zuken company news, product announcements, partnerships and new customers Software Downloads of free try-out software and viewing tools Software Evaluation Evaluation Zuken Software Software Order Software Viewer Viewing and redlining tools for Zuken software products Webinar Library of recorded Zuken webinars for replay White Paper Industry issues, required capabilites and solution approaches

Stay on the leading edge of PCB, electrical and data management technologies

5 results found
mbse-data-process-1024x576-1-510x310
  • White Paper
August 28, 2023
How to Leverage MBSE to Solve Critical Challenges in Discrete Manufacturing

This white paper introduces a solution that combines the innovative approach of Model-Based Systems Engineering (MBSE) with the best practice of managing data and processes in a PDM system.

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Design Data Management - DS-2
  • White Paper
December 12, 2018
Domain-specific Data Management

This white paper explains best-practice approaches for the management of electrical CAD data and their integration into enterprise-wide PLM and ERP environments.

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Why electrical CAD data are best managed in a domain-specific environment
reclaim-engineering-510x310
  • White Paper
December 11, 2018
Reclaiming Engineering Productivity

5 easy steps to increasing engineering productivity

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geometric-shapes-wooden-background-510x310
  • White Paper
December 11, 2018
The Modular Approach – A guide to multi-disciplinary success

To deliver on the promise of a modular product architecture strategy, companies need to create a number of prerequisites in organization, process and infrastructure.

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Chip Package Board co-design
  • White Paper
October 20, 2018
3D Convergence of Multi-board PCB and IC Packaging Design
White Paper, Design Force, Chip-Package-Board Co-Design, Design Force Advanced Packaging
Combine chips and boards in new configurations