electronics

Chip, Package and Board Design

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Complex 3D stacked structures and embedded devices

As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs.

Chip design software with concurrent co-design

We can help you with

Advanced IC Packaging

Chip, package and board co-design for realtime 3D hierarchical design allows design teams to concurrently create any combination of advanced stack dies, packages and PCBs.

System Level Circuit Engineering

Perform multi-level SI simulation for upfront verification of signal quality issues and determination of optimal termination and topology rules.

3D Multi-Board PCB Design

You can select between a combination of PCBs, packages, and SoCs into one design and complete the layout of the design as a complete system.

Customer reference

toshiba-transfer-jet-813x492-510x310
  • Case Study
October 15, 2018
Toshiba

Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone they needed to shrink the board and the module thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.

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significantly reduce product size with 3D chip, package, board co-design.

Demonstration

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More on Chip-package-board-co-design solutions

Check our latest webinars, white papers and more

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IC Power Modules - Implementation features with Design Force
  • Webinar
August 18, 2021
IC Power Module Design with CR-8000 Design Force

The typical design flow for a power module is in MCAD, where only structural analysis is possible. Moving to a new design flow using CR-8000 Design Force also allows for electrical analysis too. This webinar will demonstrate the features and benefits of this new design flow.

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CR-8000 R2021
  • Press Release
July 07, 2021
Zuken’s CR-8000 2021 Advances Early Design Analysis and Reuse Functionality

CR-8000 advances system-level PCB design with significant enhancements in analog simulation, SI analysis, and intelligent layout and routing

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how to design a printed circuit board
  • Press Release
June 16, 2020
CR-8000 2020

Key development themes for CR-8000 2020 are superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.

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FPGA optimization, skew group routing, back-drilled vias, electro-mechanical co-design,flex-rigid PCBs, multi-domain analysis, tile bump, 3D wire desi...
pcb design rules and constraint management
  • Webinar
June 04, 2020
Constraint Specification in CR-8000

In this webinar the use of the Rule Stack Editor and Clearance Class in conjunction with the Constraint Browser will be explained step by step.

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Advanced IC Packaging and Co-Design Solution with Zuken Design Force
  • Webinar
May 04, 2020
Advanced IC Packaging and Co-Design with Design Force
Webinar, Design Force Advanced Packaging, CR-8000
PR-Z0512-CHIPS-1-510x310
  • Press Release
May 22, 2019
Zuken joins the UCLA CHIPS consortium
Press Release, Design Force Advanced Packaging

Related products and extensions

Design Force for advanced electronic packaging of semiconductor technology
  • Products
January 03, 2019
Design Force Advanced Packaging

Design Force offers an intuitive, integrated environment for designing single and multi-die packages for wire-bond, flip-chip, and high density advanced IC packaging.

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IC Package and PCB Co-design
electronics
  • Solutions
October 15, 2018
Chip, Package and Board Design
Complex stacked structures and embedded devices
FPGA und pcb co design
  • Products
November 19, 2018
Graphical Pin Manager

Graphical Pin Manager offers an effective FPGA / PCB co-design environment providing support for the latest devices offered by FPGA vendors

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FPGA Pin Optimization
multi-board pcb software - ECAD MCAD collaboration - step import
  • Products
October 01, 2018
Design Force

CR-8000 Design Force is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout and verify their designs in the context of a complete system or product.

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3D Multi-board PCB Design

View all Chip-package-board-co-design blog posts

Recent Chip-package-board-co-design blog posts
A satellite in orbit around the moon, depicting advanced space technology and exploration, measuring Earth through innovative aerospace equipment and missions
  • Blog
January 24, 2022
Measuring the Earth

EREMS, a French enterprise specializing in the design and realization of high-tech electronic equipment and of associated software for Space, Defense, and Aeronautics uses CR-8000 and DS-CR from Zuken for the design and lifecycle management of flight electronics, ground electronic equipment, and test benches.

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computer-aided design program interface displaying an automatic block update with FPGA pin assignments, featuring a hierarchical block diagram and a timing diagram for electronics design
  • Blog
October 07, 2021
Automatic Block Update: Automatically generate FPGA pin assignments in Design Gateway designs

Zuken's Custom Development Group has developed a solution that enables simultaneous IC, connector, and PCB development by automating the updating of pin assignments in PCB design.

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different stage in the electrical design process, including a 3D model layout and various schematic diagrams
  • Blog
September 20, 2021
What PDN Target Impedance Means for PCB Designers

PDN impedance is becoming more and more of a headache for PCB designers as IC vendors are defining increasingly tight so-called ‘target impedance limits’. This article explains what PDN impedance means for PCB designers and what to pay particular attention to.

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Zuken blog - Is 3D Electronics Design keeping up with today’s Trends? Assessing electronics layout and 3D circuit printing
  • Blog
June 03, 2021
Is 3D Electronics Design keeping up with today's Trends?

For many years, the layout of a printed circuit board in 2D was sufficient for most mainstream technologies. Today, however, product developers in the electronics industry are facing new challenges, triggered by megatrends such as the Internet of Things. Can today's CAD tools deliver on today's advanced requirements and harness the power of new technologies?

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While we are trying to provide a comprehensive overview of our solutions portfolio, we are aware we cannot capture all process challenges of a modern business. Drop us a line and describe your challenge.
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