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Latest Resources

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  • Press Release
March 24, 2025
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

Zuken has joined the IBM Research AI Hardware Center to advance 3DIC packaging, AI hardware acceleration, and EDA workflows. The partnership underscores Zuken’s commitment to driving innovation in AI-driven chip design and next-generation semiconductor packaging solutions.

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  • Press Release
January 08, 2025
Zuken Vitech Unveils GENESYS 2024: Accelerating Systems Engineering with Advanced Capabilities
Press Release
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  • Press Release
October 08, 2024
E3.series 2025 Improves Design Efficiency with More Than Fifty Enhancements

New features simplify complex wiring system designs and panel layouts, increasing design precision

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  • Webinar
October 07, 2024
Advanced Electronics Collaboration: Zuken DS-CR and Dassault Systèmes’ 3DEXPERIENCE Platform

Discover how Zuken’s CR-8000/DS-CR integrates with Dassault Systèmes’ 3DEXPERIENCE Platform, providing robust solutions for efficient data management and collaborative workflows between electrical and mechanical design teams.

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The enhanced formboard copilot helps designers draw their harness segments quickly and efficiently.
  • Press Release
September 09, 2024
Zuken Introduces Harness Builder 2025 for E3.series with Enhanced Integration and Documentation Capabilities

Zuken introduces Harness Builder 2025 for E3.series, featuring enhanced automation, improved formboard copilot features, and seamless machine integration. This latest release streamlines wiring harness design, boosting precision and efficiency for engineers. With new support for industry-standard machines and extended ERP integration, Harness Builder 2025 simplifies complex designs and accelerates time-to-market.

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