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Recent Resources

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  • Blog
January 15, 2026
Industry 4.0 vs Digital Transformation: How Japan Is Moving Beyond Efficiency

Executives’ Perspectives on Digital Transformation #3

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Executives’ Perspectives on Digital Transformation #3
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  • Blog
December 10, 2025
What Can Go Wrong with Wire Lengths, Diameters, and Offsets

Despite the best intentions of design engineers, seemingly perfect schematics can unravel the moment they hit the shop floor, especially in wire harness and control cabinet manufacturing. When tiny oversights spark major production headaches, the real question becomes: how can smarter design tools finally close this costly gap?

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E3.series supports fast, efficient manufacturing
  • Blog
November 11, 2025
E3.formboard Basics: From Schematic to Build-Ready Harness Layouts

Learn how E3.formboard turns schematics into build-ready harness layouts - lengths, splices, tables, protection, and EMC - for faster, repeatable shop-floor assembly.

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Mastering E3.series with Harry - Episode 5
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  • Blog
November 05, 2025
#2: The Productivity Paradox

Executives’ Perspectives on Digital Transformation #2 The Productivity Paradox

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Executives’ Perspectives on Digital Transformation #2
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  • Blog
October 29, 2025
How to Stay Competitive in a Changing Business Environment

Executives’ Perspectives on Digital Transformation #1 From Efficiency to Dynamic Capability

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Executives’ Perspectives on Digital Transformation #1
Electric Car, Electric Vehicle, Charging - Sports, Working, Showing
  • Webinar
October 16, 2025
What's New in E3.series 2026 for Wire Harness Design
Webinar, E3.cable, E3.3D RoutingBridge, E3.3DTransformer
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  • Press Release
September 09, 2025
E3.series Release 2026

The new release focuses on minimizing repetitive tasks, improving data integrity, and accelerating project timelines - particularly for designs involving complex variants, large component libraries, or integrated 2D/3D workflows.

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  • Press Release
September 04, 2025
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Inc. has joined the JOINT3 consortium—an industry co-creation platform led by Resonac to accelerate the development of next-generation semiconductor packaging materials, equipment, and design tools for panel-level organic interposers—where Zuken will contribute its CR-8000 Design Force expertise to help demonstrate, optimize, and evolve design and manufacturing processes that address the growing demand for 2.xD and 3D semiconductor packages in applications such as generative AI and autonomous driving.

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