Welcome to the April issue of the Zuken Newsletter! We’re excited to kick off this edition with big news: Zuken has joined the IBM Research AI Hardware Center. This strategic collaboration brings Zuken into a global ecosystem driving innovation in AI hardware—an exciting step forward in shaping the future of intelligent electronic design.

Also in this issue, we dive into the key differences between ECAD and MCAD, and how understanding their roles can enhance collaboration and streamline design workflows. Plus, we explore the power of ECAD-PLM integration with Zuken’s DS-CR and Dassault’s 3DEXPERIENCE, highlighting how it improves efficiency and reduces design errors.

Registration is now open for Zuken Innovation World 2025 in Switzerland, France, Italy, and Germany!

UK date is confirmed, so make sure to save the date.

BLOG

Zuken Joins IBM Research AI
Hardware Center

Zuken Inc. has joined the IBM Research AI Hardware Center to collaborate on next-gen AI chip development, focusing on heterogeneous integration and 3DIC packaging design. As part of the collaboration, Zuken and IBM will jointly advance heterogeneous chip integration and 3DIC packaging design.

Read the Full Announcement

Blog and On-Demand Webinar

ECAD and PLM Integration with
Zuken DS-CR and Dassault’s
3DEXPERIENCE

As electronics and software rapidly evolve, integrating mechanical, electrical, and software engineering is vital. Learn how Zuken’s DS-CR and Dassault’s 3DEXPERIENCE offer a practical solution that boosts collaboration, streamlines workflows, and reduces errors—while safeguarding your existing engineering infrastructure.

Learn More About ECAD-PLM Integration

Blog and On-Demand Webinar

The Difference between ECAD and MCAD

Integrating ECAD and MCAD design environments is critical for managing the complexity of today’s multidisciplinary products. Learn about key aspects that need to be considered in our webinar on Efficient Harness Design through ECAD-MCAD Integration.

Explore ECAD-MCAD Best Practices

Zuken Innovation World 2025 Registration is Now Open!

ZIW (Zuken Innovation World) is an annual conference where industry professionals gather to explore the latest Zuken solutions, share insights, and collaborate on design innovation.

Switzerland: June 5th – Campus Sursee, Lucern
France: June 12th – Palais de Congrès, Paris Massy
Italy: June 17th – Savoia Hotel Bologna
Germany: September 15th/16th – Lufthansa Seeheim Hotel
UK: September 30th/ October 1st - Hotel La Tour, Milton Keynes

More ZIW Information

Upcoming Events:

SCB Expert Days (6-8 May - Detmold / 24-26 June - Nuremberg, Germany)
Siemens PLM Connection (24-25 June - Seeheim, Germany)
Sindex (2-4 September - Bern, Switzerland)
DSEI 2025 (9-12 September - London, United Kingdom)

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