This video demonstrates how you can export a STEP file from CR-8000 Design Force including automatically editing your package shape and deformation spec to reduce heat transfer and fluid flow simulation time in ANSYS Icepak. Changing the micro-bumps in the detailed model using an octagonal shape and simplifying the grid pattern (size) will reduce the meshing and calculation time without sacrificing accuracy, leading to faster thermal simulation.
Related Products and Resources
- Products
Design Force offers an intuitive, integrated environment for designing single and multi-die packages for wire-bond, flip-chip, and high density advanced packaging. Designers can start designs with early prototype input of chip and package data from the library, reuse data from IC layout tools, and take advantage of parametric wizards to streamline the creation of the system
- Products
- Products
Design Force combines traditional 2D design with native 3D design and the latest human interface techniques, accelerated graphics and almost instantaneous rendering and refreshing. It is the fastest, most effective PCB design solution available today. Design Force enables design teams to layout their designs in the context of a complete system or product.
- Products
Building a competitive product today is much more difficult than a few years ago. Existing PCB-centric design processes are limited to a single PCB and do not provide the necessary tools for today’s competitive product development environment. PCB-centric design processes are falling behind.