The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
DPC 2024 will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
IMAPS DPC 2024 has so much to offer:
- DPC 2024 will feature 12 outstanding Professional Development Courses.
- 5 Keynote Presentations, with the following now confirmed:
- Sitaraman (Sita) Balasubramanian, Aptiv
- Hemanth Dhavaleswarapu, AMD
- Pradeep Lall, Auburn University
- Rajendra (Raj) D. Pendse, Meta
- Pooya Tadayon, Intel
- DPC 2024 received a record number of abstract proposals with nearly 100 author submissions
- 2.5 days of speakers across three tracks: Heterogeneous 2D & 3D Integration; Fan-Out, Wafer Level Packaging & Flip Chip; Next Gen Applications (Automotive, 5G/6G…)
- The Next Gen Applications track will feature 2 invited sessions: iNEMI 5G/6G Roadmap Creation and Packaging challenges; and Additive Manufacturing.
- The 2024 program will also feature the GBC Plenary Session: How Geopolitics are Reshaping the Global Semiconductor Industry, evening Panel Session and Reception, DEI Session, Welcome Reception, Exhibit Hall Reception and the ever-popular Interactive Poster Session with the 3D InCites DEI Fund Happy Hour
- We have seen a record number of corporate sponsors for next year’s DPC and the earliest SOLD OUT exhibit hall in the 20-year history of Device Packaging!
