Enhancing PCB Performance with Embedded Capacitance and EDA Tools

Abstract

Engineers are facing a growing challenge in PCB design: ensuring electromagnetic compatibility (EMC), signal integrity (SI), and power integrity (PI) all while dealing with limited space. PCBs often lack room for decoupling capacitors, have height restrictions like those on PCIe cards, and face demands for miniaturization. To overcome these obstacles, we need to incorporate thorough PI analysis and verification using modern Electronic Design Automation (EDA) tools.

Participants can expect to gain a comprehensive understanding of embedded capacitance materials, including their definition and applications. The webinar will provide detailed guidance on how to implement embedded capacitance materials in PCB designs, ensuring attendees are equipped with practical knowledge and techniques. Additionally, the webinar will cover strategies to optimize power integrity analysis and verification, offering valuable insights to enhance design efficiency and performance.

What you will learn:

• Greater understanding of embedded capacitance materials
• Tips for PCB design and stack-up creation using embedded capacitance materials
• Techniques to optimize PI analysis and verification
• How to run power integrity simulations and interpret the results”

Who should attend:

• Hardware Engineers
• PCB Designers
• SI/PI/EMC Engineers
• Engineering directors and managers

Speakers

Bob Carter – Vice President of Business Development and Technology, Oak-Mitsui Technologies

Vice President of Marketing, Business Development, and Technology for Oak-Mitsui’s FaradFlex ultra-thin embedded capacitance materials and support of advanced technology low loss low profile VSP copper and Micro-Thin copper. He has over 35 years of professional experience in printed circuits, advanced electronic materials, MEMs, RF modules, sensors, and chip packaging. Directs engineering, marketing, and sales worldwide. Initiated the start-up of 2 major PCB factories in China. Led engineering, development, and application organizations at companies such as Xerox, Toppan, Multi-Fineline Electronix, Rogers Corporation, Flex2Chip Inc, and Panasonic Electronic Materials. Bob studied Chemical & Materials Engineering and Business Management at California Polytechnic University, Pomona, California, and Grand Canyon University, Phoenix, Arizona, and has a BS Degree.

Yoshi Fukawa – President and Founder, TechDream, Inc.

Yoshi Fukawa received his B.S. degrees in Electrical Engineering from Tokyo University of Science, Japan, in 1988. He received a certification of iNARTE EMC Engineer in 2000. He was an EMC committee member of JEIDA in Japan and currently a member of IEEE EMC Society. He is a founder of TechDream based in Silicon Valley who has been providing leading-edge EMC solutions offering EMI/SI/PI simulation software, near-field EMI scanner and advanced PCB materials in US. He submitted several joint-papers to IEEE EMC Symposium, EMC Europe and DesignCon.

Lance Wang – Solutions Architect, Zuken USA

Lance Wang is a signal integrity expert and Solutions Architect at Zuken USA Inc. He primarily supports Zuken CR-8000 for high-speed board design and SI/PI analysis. Lance has almost 30-year experience in the SI and PI fields. Currently, he is also the Chair of IBIS Open Forum. Prior to working at Zuken, Lance was the founder of IO Methodology Inc., which specialized in SI modeling and system analysis. In his early professional career, he was a product manager at Cadence, a system design engineer at GSI Lumonics, and an RF designer at Motorola.