Zuken USA Opens Call for Papers for Zuken Innovation World 2023

WESTFORD, MA, USA, October 25, 2022 – Zuken USA, Inc, is now accepting abstracts for Zuken Innovation World Americas (ZIW) 2023, to be held June 5-8 in Scottsdale, Arizona. The annual user and technology conference includes two and a half days of technical classes, a partner exhibition, Expert Bar, and the networking benefits of the traditional in-person format. The conference will again be co-located with Vitech’s Integrate23, an international symposium for digital engineering.

Digital Engineering

Digital Engineering will play a central role in this year’s conference. As companies look to digital engineering to address increasing product complexity and improve the product development process, they are searching for innovative solutions. The ZIW conference agenda will offer courses on the Digital Engineering process, including model construction, architecture optimization, and the connection to detailed design.

Education and Networking

Participants can move freely between the two conferences and will have the opportunity to attend classes across seven dedicated tracks. The agenda will include how-to and best practices for current and upcoming product releases, customer case studies, and forward-looking topics. With the introduction of Advance Courses, seasoned users will find a selection of deep dive classes from high-speed routing to harness design and manufacturing. Zuken’s popular Expert Bar returns with one-on-one appointments with Zuken’s technical experts. ZIW and Integrate23 will share a common Technology Showcase, allowing technology partners to share their innovative complementary solutions in an interactive setting that encourages networking.

Abstract Submission

Abstracts are now being accepted for 45-minute technical presentations. The ZIW agenda consists of three tracks focused on the following areas:

• Digital Engineering initiatives and best practices, including model-based design and the digital thread.
• Board-based system design, including architecture optimization, SI/PI/EMC, ECAD/MCAD co-design and IC packaging.
• Electrical-based system design, including wire harness and panel for the transportation, power, special vehicles, and aerospace and defense industries.

Presentations must be noncommercial and focus on technology, techniques, or methodology. Case studies, how-to information, and usage tips are favored, and individual or team presentations are welcome.

Abstracts of 100 words and speaker biographies should be submitted to Zuken by January 31, 2023. For additional details and deadline information, visit the ZIW event page or contact the Conference Manager, Amy Clements. Submit abstracts here.

Additional upcoming ZIW events include:

• April 24-25, 2023 – Germany
• May 9, 2023 – Switzerland
• June 13, 2023 – France
• June 15, 2023 – Italy
• June 21-22, 2023 – United Kingdom
• October, 2023 – Yokohama, Japan