Solutions by
Stay ahead of the curve
Industry 4.0, the Internet of Things, Model Based System Engineering, and a sustained speed of innovation in the hardeware domain are profoundly changing the way products are engineered, manufactured and used. We help our customers to secure a competitive edge by consistently keeping our solutions ahead of the curve and anticipating future requirements.
Discover our contributions
- Solutions
October 15, 2018
MBSE
Up-front planning for tomorrow's complex designs
- Solutions
October 15, 2018
Industry 4.0
Respond to the challenges of digitization
- Solutions
October 15, 2018
Digital Twin
Adding connectivity to the Digital Twin
- Solutions
October 15, 2018
Printed Electronics
Working with industry leaders to enable new applications
- Solutions
October 15, 2018
AI/AR and Machine Learning
New opportunities for early adopters
- Solutions
October 15, 2018
Chip, Package and Board Design
Complex stacked structures and embedded devices
Related resources
Just some examples of how Zuken relates to emerging technologies
- Press Release
October 17, 2018
E3.series for all-electric aircraft research initiative
Press Release, Wire Harness Engineering, Ensure Your Business Responsiveness, by Emerging Technologies, Manufacturing and Service Documentation
- Press Release
April 05, 2017
PCB Design to Manufacture for 3D Printing
Press Release, Design Force, 3D Printing
- Press Release
April 01, 2015
PCB Reference Designs for Intel IoT Devices
Press Release, Design Force, Industry 4.0
- Press Release
December 19, 2014
Innovation Award for Electric Vehicle Research
Press Release, Automotive